JPH0337241Y2 - - Google Patents
Info
- Publication number
- JPH0337241Y2 JPH0337241Y2 JP1984150647U JP15064784U JPH0337241Y2 JP H0337241 Y2 JPH0337241 Y2 JP H0337241Y2 JP 1984150647 U JP1984150647 U JP 1984150647U JP 15064784 U JP15064784 U JP 15064784U JP H0337241 Y2 JPH0337241 Y2 JP H0337241Y2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- pedestal
- printed circuit
- circuit board
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 24
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 17
- 125000006850 spacer group Chemical group 0.000 claims description 14
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000004020 conductor Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984150647U JPH0337241Y2 (en]) | 1984-10-03 | 1984-10-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984150647U JPH0337241Y2 (en]) | 1984-10-03 | 1984-10-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6165767U JPS6165767U (en]) | 1986-05-06 |
| JPH0337241Y2 true JPH0337241Y2 (en]) | 1991-08-07 |
Family
ID=30708789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984150647U Expired JPH0337241Y2 (en]) | 1984-10-03 | 1984-10-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0337241Y2 (en]) |
-
1984
- 1984-10-03 JP JP1984150647U patent/JPH0337241Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6165767U (en]) | 1986-05-06 |
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